A 360-Degree View of IoT Technologies (Integrated Microsystems)
Part of: Integrated Microsystems (3 Books) | By 作者:John Soldatos
Publisher Finelybook 出版社 : Artech House (December 31, 2020)
Language 语言: English
pages 页数: 254 pages
ISBN-10 书号: 163081752X
ISBN-13 书号 : 9781630817527
The Book Description
This exciting book explores the past, present and future of IoT, presenting the most prominent technologies that comprise IoT applications, including cloud computing, edge computing, embedded computing, Big Data, Artificial Intelligence (AI), blockchain and cybersecurity. A comprehensive description of the full range of the building blocks that comprise emerging IoT systems and applications is provided, while illustrating the evolution of IoT systems from the legacy small scale sensor systems and wireless sensor networks, to today’s large scale IoT deployments that comprise millions of connected devices in the cloud and smart objects with (semi)autonomous behavior. It also provides an outlook for the future evolution of IoT systems, based on their blending with AI and the use of emerging technologies like blockchain for massively decentralized applications.
The full spectrum of technologies that are closely associated with the term IoT since its introduction are explored. The book also highlights the main challenges that are associated with the development and deployment of IoT applications at scale, including network connectivity, security, and interoperability challenges. First tech sensors, wireless sensor networks and radio-frequency identification (RFID) tags are covered. Machine learning, big data and security issues are also explored.
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