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Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Institution of Engineering and Technology | 2025 | English | 9781837241408 | 199 pages | PDF | 24 MB
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标签：Development 第44页
LLVM Code Generation: A deep dive into compiler backend development
Packt | 2025 | English | 9781837637782 | 608 pages | PDF, EPUB | 16 MB
Mastering Embedded Linux Development: Craft fast and reliable embedded solutions with Linux 6.6 and The Yocto Project 5.0 (Scarthgap), 4th Edition
Packt | 2025 | English | 9781803232591 | 710 pages | PDF, EPUB | 38 MB
Nano-Biosensor Technologies for Diagnosis of Infectious Diseases
Wiley-Scrivener | 2025 | English | 9781394287666 | 512 pages | PDF, EPUB | 29 MB
Making Money Work: How to Rewrite the Rules of Our Financial System
Wiley | 2025 | English | 9781394257263 | 368 pages | PDF, EPUB | 10 MB
Handbook of Artificial Intelligence for Smart City Development: Management Systems and Technology Challenges
CRC | 2025 | English | 9781041094012 | 230 pages | PDF, EPUB | 15 MB
Generative AI with LangChain: Build production ready LLM applications and advanced agents using Python and LangGraph, 2nd Edition
Packt | 2025 | English | 9781837022014 | 476 pages | PDF, EPUB | 12 MB
Effective Serious Games Development
CRC | 2025 | English | 9781032610139 | 234 pages | PDF, EPUB | 131 MB
Fundamental and Applied Problems in Terahertz-related Devices and Technologies
World Scientific | 2025 | English | 9789811286803 | 152 pages | PDF, EPUB | 19 MB
Translation Studies in the Age of Artificial Intelligence
Routledge | 2025 | English | 9781032756301 | 236 pages | PDF, EPUB | 11 MB