Recent Trends in VLSI and Semiconductor Packaging

Recent Trends in VLSI and Semiconductor Packaging

Recent Trends in VLSI and Semiconductor Packaging

Author:by T. Vasudeva Reddy (Editor), K. Madhava Rao (Editor)

Publisher finelybook 出版社:‏CRC Press

Edition 版本:‏1st edition

Publication Date 出版日期:‏2025-05-6

Language 语言:English

Print Length 页数:616pages

ISBN-10:1041017863

ISBN-13:9781041017868

Book Description

The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies (“SMART-2024”) aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. “SMART-2024” seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.

About the Author

T. Vasudeva Reddy is an Associate Professor in Electronics and Communication Engineering (ECE), B V RAJU Institute of Technology, Narsapur. His expertise lies in enhancing electronic system efficiency, focusing on power consumption, area utilization, and signal delay optimization. His research encompasses Low Power SRAM Architectures, Sub-threshold SRAM Designs, and MEMS Devices for Coagulation Effect, supported by a rich publication record and a commitment to innovative research.

K. Madhava Rao, Assistant Professor at B V RAJU Institute of Technology, Narsapur since 2016, boasts a comprehensive exploration and contribution to electronics and communication engineering. His research covers hardware implementation, low-power techniques, FPGA-based systems, and advanced memory designs, presented at international conferences and esteemed journals.

下载地址

PDF, EPUB | 219 MB | 2025-03-09
下载地址 Download解决验证以访问链接!
打赏
未经允许不得转载:finelybook » Recent Trends in VLSI and Semiconductor Packaging

评论 抢沙发

觉得文章有用就打赏一下

您的打赏,我们将继续给力更多优质内容

支付宝扫一扫

微信扫一扫