Practical Guide for the Reliable Packaging of Electronics
Author: Ali Jamnia (Author)
Publisher finelybook 出版社: CRC Press
Publication Date 出版日期: 2025-09-25
Edition 版次: 4th
Language 语言: English
Print length 页数: 332 pages
ISBN-10: 1032881143
ISBN-13: 9781032881140
Book Description
A definitive guide for both newcomers to the field and those in need of a refresher, the fourth edition of Practical Guide to the Reliable Packaging of Electronics provides a comprehensive understanding of the thermal and mechanical aspects of electromechanical system design, along with insights into potential failures. This edition equips design engineers with the tools to assess their work in the early stages of development, helping them identify and address weak points before they lead to system failures.
As the demand for integrating more electronic capabilities into smaller packages continues to rise, product developers and manufacturers must carefully consider how module placement and component selection impact performance. This updated edition features expanded content, including advancements in cooling technologies and materials, guidance on vibration isolation and design challenges, deeper insights into system and subsystem reliability, robust test method development, and a newly added section on applying Six Sigma DMAIC methodology for thermal and mechanical failure analysis.
By consulting this essential resource, engineers, program managers, and quality assurance professionals involved in electromechanical systems will gain a solid foundation in electronics packaging. Readers will learn to establish design guidelines, recognize potential reliability issues, and perform more thorough analyses, ultimately leading to more reliable and efficient system designs.
Review
“This book is intended for a hands-on engineer who needs back-of-the-envelope tools to develop design parameters and develop a means to conduct sanity checks. The true value of the book, however, is to raise the awareness of the design team on various aspects of the design that leads to developing a more reliable product.”
―James Feine, President, USI Ultrasonic, Houston, Texas, USA
About the Author
Dr. Jamnia has published four books with , a large number of engineering papers and presentations as well as non-technical articles along with a number of patents. He has a demonstrated basic understanding of the engineering principles particularly in the areas of fluid flow, heat transfer and stress analysis. His primary expertise lies in electromechanical systems design and analysis particularly using numerical approximations and computer simulation. Currently, he heads design for reliability, compliance and safety activities for a medical device company.
His focus on the issues of electronics packaging began in the early 90s. And since 1995, he has been involved with the design and development of innovative electronics system particularly in the medical field. His prime achievement was the development of a specialized computer systems called the Learning Stationä to be used as teaching tool for individuals with cognitive delays and/or physical disabilities.
Dr. Jamnia enjoys teaching and interacting with others. In fact, Society for Automotive Engineers (SAE) had sponsored him for nearly ten years to teach workshops on electronics packaging form a thermal and mechanical design and analysis point of view.
