
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging (Materials, Circuits and Devices) Author:...
Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging (Materials, Circuits and Devices) Author:...
Applied Soft Computing Techniques Author: Samarjeet Borah (Editor), Ratna Raja Kumar Jambi (Editor), Sharifah Sakinah Sy...
Math for Data Science Author: Omar Hijab (Author) Publisher finelybook 出版社: Springer Publication Date 出版日期: 2025-05-27 ...
Controller Design for Industrial Applications Author: Arindam Mondal (Editor), Souvik Ganguli (Editor) Publisher finelyb...
Generative AI Unleashed: Advancements, transformative applications and future frontiers (Computing and Networks) Author:...
LLVM Code Generation: A deep dive into compiler backend development Author: Quentin Colombet (Author) Publisher finelybo...
Mastering Embedded Linux Development: Craft fast and reliable embedded solutions with Linux 6.6 and The Yocto Project 5....
Nano-Biosensor Technologies for Diagnosis of Infectious Diseases Author: Suvardhan Kanchi (Editor), Ayyappa Bathinapatla...
Making Money Work: How to Rewrite the Rules of Our Financial System Author: Matt Sekerke (Author), Steve H. Hanke (Autho...
Scala for the Impatient Author: Cay Horstmann (Author) Publisher finelybook 出版社: Addison-Wesley Professional Publicatio...