finelybook
Data-Driven Fault Diagnosis
Author: Govind Vashishtha (Author)
Publisher finelybook 出版社: CRC Press
Publication date 出版日期: 2025-09-22
Edition 版次: 1st
Language 语言: English
Print length 页数: 188 pages
ISBN-10: 1041011636
ISBN-13: 9781041011637
Book Description
Data-Driven Fault Diagnosis: A Machine Learning Approach for Industrial Components delves into the application of machine learning techniques for achieving robust and efficient fault diagnosis in industrial components.
The book covers a range of key topics, including data acquisition and preprocessing, feature engineering, model selection and training, and real-time implementation of diagnostic systems. It examines popular machine learning algorithms such as support vector machines, convolutional neural networks, and extreme learning machines, highlighting their strengths and limitations in different industrial contexts. Practical case studies and real-world examples from various sectors illustrate the real-world impact of these techniques.
The aim of this book is to empower engineers, data scientists, and researchers with the knowledge and tools necessary to implement data-driven fault diagnosis systems in their respective industrial domains.
About the Author
Govind Vashishtha received a PhD degree in Mechanical Engineering from the Sant Longowal Institute of Engineering and Technology, Longowal, India, in 2022. He is currently working as a Visiting Professor at Wroclaw University of Science and Technology, Wroclaw, Poland. He has authored over 70 research papers in Science Citation Index (SCI) journals and also edited one book. His name also appeared in the world's top 2% scientist list published by Stanford University in 2023 and 2024. He is also serving as Associate Editor in Frontiers in Mechanical Engineering, Shock and Vibration, Measurement and Engineering and Applications of Artificial Intelligence. He has two Indian patents. His H-index is 27 and has been cited in more than 1700 citations. His current research includes fault diagnosis of mechanical components, vibration and acoustic signal processing, identification/measurement, defect prognosis, machine learning and artificial intelligence.
