Advancements in AI and IoT for Chip Manufacturing and Defect Prevention (River Publishers Rapids Series on Intelligence in Chips)
Author: Rupal Jain (Author)
Publisher finelybook 出版社: River Publishers
Edition 版本: 1st
Publication Date 出版日期: 2024-11-25
Language 语言: English
Print Length 页数: 152 pages
ISBN-10: 8770046816
ISBN-13: 9788770046817
Book Description
This is essential reading for semiconductor professionals seeking to expand their knowledge on silicon processes, understand the significance of defect prevention, and explore methods for optimizing processes by reducing defects using AI and IoT technologies.
In the dynamic landscape of semiconductor manufacturing, the focus on processes and defect prevention stands paramount. Traditional approaches have yielded valuable insights, yet the emergence of Artificial Intelligence (AI) and Internet of Things (IoT) technologies heralds a new era in defect prevention strategies. Engineers specializing in AI and machine learning, interdisciplinary researchers, and early graduates aspiring to enter the semiconductor industry will also find this book invaluable.
Meticulously crafted, this book provides concise, yet insightful content tailored to today’s fast-paced readers. It emphasizes semiconductors, manufacturing processes, and defect prevention, offering a comprehensive understanding of these critical areas. The integration of AI and IoT in chip manufacturing defect prevention represents a groundbreaking advancement.
Targeting semiconductor engineers, researchers, technology professionals, and students, this book serves as a valuable resource for understanding the interplay between semiconductors, manufacturing processes, defects, and the transformative potential of AI and IoT integration. Practical tools for failure analysis and parameter control are provided, along with hypothetical use cases and theoretical applications that inspire innovation. Through interdisciplinary insights, this book charts a course toward a future where semiconductor manufacturing defects are minimized, productivity is maximized, and innovation thrives at the intersection of technology and industry.
About the Author
Rupal Jain is a distinguished figure in the field of semiconductor chip manufacturing, with extensive expertise in engineering, program management, and strategic alignment. Throughout her career, she has spearheaded projects encompassing the entire chip development lifecycle – from design conception and quality management to global delivery across regions like the USA, Taiwan, Singapore, Italy, Malaysia, China, and India. Her profound knowledge is recognized by prestigious certifications like PMP, CSM, and Lean Six Sigma Black Belt. Rupal holds a master’s degree in electrical and Electronics Engineering, earned through a joint program between NTU Singapore and TUM Germany. Beyond her technical prowess, Rupal’s innovative contributions have garnered international acclaim. She is a frequent contributor to esteemed publications, serves on prestigious juries, and holds nominated memberships in industry organizations. Notably, her work has been recognized with coveted awards and patents, further solidifying her position as a leader in the field. Her other authored pieces- “”Mastering Project Management: PMP and Agile for Leaders”” and “”Semiconductor Essentials : A Leader’s Express reference to Electronics Concepts”” promise to share her valuable insights with the next generation of leaders and engineers.
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